AGP Executive Report
Last update: 7 minutes agoSemiconductor Manufacturing: Intel has started using ASML’s $400M High-NA EUV lithography tool at its Hillsboro, Oregon site to produce parts of its next-gen Panther Lake laptop chips on the Intel 18A process, marking the first high-volume logic product patterned with the technology. Research & Innovation Funding: Oregon’s Frontiers of Advanced Semiconductor Technology (FAST) consortium—nearly 100 partners led by Oregon State University—won an NSF Regional Innovation Engines grant of up to $160M over 10 years to expand the state’s semiconductor ecosystem. AI Policy: Nearly 200 economists, researchers, and tech leaders warned policymakers that unmanaged AI could rapidly displace jobs and concentrate power, urging faster action on safeguards and institutions. Public Health & Safety: A new report highlights how heat waves can be deadlier indoors, especially when air conditioning fails or homes lack cooling. Higher Ed: Willamette University and Pacific University formally agreed to merge, aiming to create Oregon’s largest private university with about 6,000 students. Data Privacy: Oregon is among districts facing a DOJ investigation tied to technology systems and data review, with officials saying they still don’t know why they were targeted.
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